面向Micro-LED封装的先进半导体键合集成技术Advanced Semiconductor Bonding Technology for Micro-LED Integration母凤文北京青禾晶元半导体科技有限责任公司董事长兼总经理MU FengwenPresident and General Manager of Innovative Semiconductor Substrate Technology co., Ltd.
CSP芯片级封装在Mini-LED背光中的应用进展The Progress of Chip Scale Package in Mini-LED TV Backlighting刘国旭北京易美新创科技有限公司CTO、执行副总裁Jay Guoxu LIUCTOExecutive VP of ShineOn Innovation Technology Co., Ltd
面向的Ga2O3功率器件应用：封装、鲁棒性和多维器件Ga2O3Power Device Toward Application: Packaging, Robustness, and Multidimensional Devices张宇昊弗吉尼亚理工大学电力电子中心副教授ZHAGN YuhaoAssociate Professor of Center for Power Electronics Systems at Virginia Tech
教育用封装光源颜色参数漂移及热特性分析研究Analysis and research on color parameter drift and thermal properties of packaged light source applied in education王书昶常熟理工学院副教授WANG ShuchangAssociate Professor of Changshu Institute of Technology
GaAs VCSEL 先进封装技术进展及应用Progress of Advanced Packaging Techniques for GaAs-based VCSELs and Its Applications林胜宁波升谱光电股份有限公司副总经理LIN ShengDeputy General Manager of NINGBO SUNPU LED CO.,LTD.
耐高温无机胶及白光/深紫外LED封装研究Enhanced heat dissipation of high-power WLEDs through creation of 3D dams on ceramic substrate with geopolymer/graphene paste孙庆磊中国地质大学（武汉）先进制造中心副教授SUN QingleiAssociate Professor of Advanced Manufacturing Center of China University of Geosciences (Wuhan)
耐高能量密度照明及健康照明封装发展机遇及挑战Development opportunities and challenges of high energy density lighting and health lighting packaging陈磊旭宇光电（深圳）股份有限公司研发总监、清华大学博士后CHEN LeiRD Director of XUYU OPTOELECTRonICS(SHENZHEN) CO., LTD.
集成反射器的封装技术用于提升高功率UVC LED芯片的光提取效率Enhanced Light Extraction Efficiency of high power UVC LEDs by SMD-Packaging with Integrated Reflectors胡晓东德国MSG Lithoglas GmbH亚太地区总监HU XiaodongDirector of Asia Pacific Region of MSG Lithoglas GmbH, Germany
背光模组中Mini LED对封装材料的要求与挑战Requirements and Challenges for Packaging Materials for Mini LEDs used in Backlight Modules徐建军北京康美特科技股份有限公司首席技术官Jianjun XUCTO of Beijing KMT Technology Co., Ltd.
先进封装大板扇出研发及功率器件封装应用The Research on Panel Level Fan Out Package and its Application on Power Electronics林挺宇广东佛智芯微电子技术研究有限公司副总经理，广东省半导体智能装备与系统集成创新中心首席科学家Tingyu LINDeputy General Manager of Guangdong FZX Microelectronics Technology Co. Ltd, Principal Scientist of CNC Equipment Cooperative Innovation Institute
美国智能照明工程技术研究中心主任, 美国伦斯勒理工学院教授Robert F. KARLICEK做了题为 LED和LED封装的未来趋势的主题报告，探讨了一些可能性，包括未来的城市照明需求、照明和视频的融合可能性、以及其他LED照明系统在未来的应用。 Robert F. KARLICEK教授有超过25年与产业领头人（包括ATT Bell Labs、EMCORE、通用电气、Gore Photonics和Microsemi）合作进行光电器件的研究、研发、和制造的经验。他的主要研究重点是开发了固态
