面向Micro-LED封装的先进半导体键合集成技术Advanced Semiconductor Bonding Technology for Micro-LED Integration母凤文北京青禾晶元半导体科技有限责任公司董事长兼总经理MU FengwenPresident and General Manager of Innovative Semiconductor Substrate Technology co., Ltd.

耐高温无机胶及白光/深紫外LED封装研究Enhanced heat dissipation of high-power WLEDs through creation of 3D dams on ceramic substrate with geopolymer/graphene paste孙庆磊中国地质大学（武汉）先进制造中心副教授SUN QingleiAssociate Professor of Advanced Manufacturing Center of China University of Geosciences (Wuhan)

多热阻阵列LED模块的结温监视 Junction Temperature Monitoring of the Multi-LED Module in Service with the Thermal Resistance Matrix李世玮 香港科技大学先进微系统封装中心主任、香港科技大学深圳研究院常务副院长 Shi-Wei.Ricky LEEProfessor and Director of Center for Advanced Microsystems Packaging (CAMP) of Hong Kong University of Science and Technology.