面向Micro-LED封装的先进半导体键合集成技术Advanced Semiconductor Bonding Technology for Micro-LED Integration母凤文北京青禾晶元半导体科技有限责任公司董事长兼总经理MU FengwenPresident and General Manager of Innovative Semiconductor Substrate Technology co., Ltd.
面向的Ga2O3功率器件应用：封装、鲁棒性和多维器件Ga2O3Power Device Toward Application: Packaging, Robustness, and Multidimensional Devices张宇昊弗吉尼亚理工大学电力电子中心副教授ZHAGN YuhaoAssociate Professor of Center for Power Electronics Systems at Virginia Tech
面向柔性显示与传感的有机薄膜晶体管器件与阵列集成Organic Thin Film Transistor Device and Array Integration for Flexible Display and Sensing郭小军上海交通大学教授GUO XiaojunProfessor of Shanghai Jiaotong University
面向AR微显示应用的超小尺寸氮化物Micro-LED研究Study on ultra-small III-nitride Micro-LEDs for AR applications汪莱清华大学信息电子工程系光电子研究所所长WANG LaiInstitute of Information Optoelectronic Technology, Department of Electronic Engineering, Tsinghua University
面向功率器件的高性能AlN陶瓷基板High Performance AlN Ceramic Substrate for Power Devices梁超江苏博睿光电股份有限公司副总经理LIANG ChaoDeputy General Manager of Jiangsu Bree Optronics Co., Ltd
面向柔性和垂直电子器件的外延氧化镓薄膜Epitaxial Ga2O3 thin film membrane for flexible and vertical electronics李晓航沙特阿卜杜拉国王科技大学副教授（陆义代讲）LI XiaohangAssociate Professor at King Abdullah University of ScienceTechnology
