基于大失配外延的氮化物第三代半导体材料与器件Nitride Semiconductor Materials and Devices Based on Large Mismatch Epitaxy沈波北京大学理学部副主任、特聘教授SHEN Bo Deputy Deanand Distinguished Professorof Facultyof Science, Peking University

半导体材料产业的现状和挑战Status and Challenge of Semiconductor Material Industry杨德仁中国科学院院士、浙大宁波理工学院校长、浙江大学硅及先进半导体材料全国重点实验室主任、教授YANG DerenAcademician of Chinese Academy of Sciences,President of NingboTech University, Professor and Director of State Key Laboratory of Silicon and Advanced Semiconductor Materials, Zhejiang University

GaN基光电材料外延与MOCVD反应腔结构关联性研究Research on the Correlation Between GaN-based Optoelectronic Material Epitaxy and MOCVD Reactor Chamber Structure姚威振中国科学院半导体研究所副研究员、中科重仪半导体联合创始人YAO WeizhenAssociate Professor of Institute of Semiconductors, Chinese Academy of Sciences, Co-founder of CASInstruments Semiconductor Co., Ltd.

硅衬底GaN基光电材料外延生长Epitaxial Growth of GaN Based Photoelectric Materials on Silicon Substrate孙钱中国科学院苏州纳米技术与纳米仿生研究所研究员SUN QianProfessorof Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences

氮化铝基半导体材料及器件的最新进展Recent Progress on AlN-based Semiconductor Materials and Devices谷保芳孝日本NTT基础研究实验室负责人、资深杰出研究员Taniyasu YOSHITAKAGroup leader and Senior Distinguished Researcher of NTT Basic Research Laboratories, NTT Corporation

氮化铝单晶材料研究进展与应用展望Research Progress and Application Prospect of AlN Single Crystal Materials程红娟中国电子科技集团第四十六所新材料研发中心副主任CHENG HongjuanDeputy Director of New Materials Research and Development Center of CETC 46THInstitute

第四代半导体材料平坦化研究进展Research Progress on Planarization of Fourth Generation Semiconductor Materials赵志强北京艾姆希半导体科技有限公司销售总监ZHAO ZhiqiangSales Director of MCF Technologies Ltd.

氧化镓材料和电子器件的热特性Thermal Characteristics of Ga2O3Materials and Electronic Devices孙华锐哈尔滨工业大学（深圳）教授，理学院副院长SUN HuaruiProfessor of Harbin Institute of Technology, Shenzhen

电流/功率截止频率为135/310 GHz的高性能硅基InAlN/GaN HEMTsHigh-Performance InAlN/GaN HEMTs on Silicon Substrate with fT/fmax of 135/310 GHz 崔鹏山东大学新一代半导体材料研究院研究员CUIPengResearch Fellow of the Institute of Novel Semiconductor of Shandong University

无等离子体损伤GaN HEMT极化隔离的设计与优化Design and optimization of polarization isolation toward plasma-damage-free GaN HEMT戴贻钧中国科学院宁波材料技术与工程研究所DAI YiyunNingbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences

新型宽禁带压电半导体材料-Ga2O3及其在射频谐振器中的应用-Ga2O3: an Emerging Wide Bandgap Piezoelectric Semiconductor for Application in Radio Frequency Resonators王钢中山大学佛山研究院院长，中山大学半导体照明材料及器件国家地方联合工程实验室主任、教授WANG GangProfessor and Dean of Foshan Institute of Sun Yat-Sen University; Director of the National-Local Joint Engineering Laboratory of Semiconductor

用于先进SiC功率模块的整体解决（核心设备/材料/工程）方案Overall solution (core equipment/materials/engineering) for advanced SiC power module周鑫苏州博湃半导体技术有限公司市场销售总监ZHOU XinDirector of Sales Marketing, Suzhou Bopai Semiconductor Technology Co., Ltd.

高性能GaN-on-GaN材料与器件的外延生长High output power and bandwidth of c-plane GaN-on-GaN micro-LED for high-speed visible light communication王国斌江苏第三代半导体研究院研发部负责人WANG GuobinSenior Project ManagerHead of RD Dept of Jiangsu Institute of Advanced Semiconductors

平片蓝宝石衬底上高质量AlN材料MOCVD外延生长High quality AlN growth on flat sapphire at relative low temperature by MOCVD赵德刚中国科学院半导体所研究员ZHAO DegangProfesor of Institute of Semiconductors, CAS

垂直氮化镓器件，尤其是硅衬底上，因其低成本衬底而引起了人们对大功率应用的广泛关注。但其性能仍低于氮化镓衬底上的垂直氮化镓器件。关键问题是在硅衬底上实现低位错密度和连续厚氮化镓层具有挑战性。会上，北京大学冯玉霞博士结合具体的研究实践，分享了Si衬底上GaN基外延材料生长及杂质缺陷研究的成果，首次提供了在C掺杂半绝缘氮化镓中取代C原子占据N位点的明确证据。

西安电子科技大学教授张金风做了题为金刚石超宽禁带半导体材料和器件新进展的主题报告。她介绍说，金刚石属于新兴的超宽禁带半导体材料，具有禁带宽度大，耐击穿，载流子迁移率高，热导率极高，抗辐照等优点。在热沉，大功率、高频器件，光学窗口，量子信息等领域具有极大应用潜力。报告中介绍了大尺寸金刚石单晶的制备方法最成功的是同质外延的克隆拼接生长方法和在Ir衬底上异质外延的生长方法。她表示，实现室温下高电离率的体掺

英诺赛科研发中心副总裁David C. ZHOU分享了《200mm 40V-650V E型硅基氮化镓材料功率器件技术：从器件、封装、到系统》研究报告